We appreciate your interest in our selection of parts that fall under the NSN 5962-01-339-7104. Below, top-requested part numbers like 5962-8867002LX, ROM PROM HEAD 264, 5962-8867002LB, PALC22V10-30DMB, 351-5866-012, and others are presented alongside their manufacturer for your perusal. In order to receive pricing options on any featured NSN 5962-01-339-7104, simply click on the “RFQ” button next to it and complete the quote request form you are directed to. Be sure to include as many details as you can about your requirements and restrictions alike so our team can best formulate ideal fulfillment options for your consideration.
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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-339-7104 (013397104) |
| NCB Code | USA (01) |
| Manufacturer | Dla Land And Maritime, Cypress Semiconductor Inc, Rockwell Collins Aerospace, Mmi Amd, General Dynamics Land Systems Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| 5962-8867002LX | dla land and maritime | microcircuit memory | RFQ |
| ROM PROM HEAD 264 | dla land and maritime | microcircuit memory | RFQ |
| 5962-8867002LB | dla land and maritime | microcircuit memory | RFQ |
| PALC22V10-30DMB | cypress semiconductor inc | microcircuit memory | RFQ |
| 351-5866-012 | rockwell collins aerospace | microcircuit memory | RFQ |
| 5962-88670 | dla land and maritime | microcircuit memory | RFQ |
| PALC22V10H-30MJS883B | mmi amd | microcircuit memory | RFQ |
| 391-0351-032 | rockwell collins aerospace | microcircuit memory | RFQ |
| 5962-8867002LA | dla land and maritime | microcircuit memory | RFQ |
| 7573733-300 | general dynamics land systems inc | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM ACCESS |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 MILLIAMPERES FORWARD CURRENT,NONREPETITIVE,MAXIMUM PEAK TOTAL VALUE NOMINAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR LOGIC ARRAY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| Relevant Components for NSN - 5962-01-339-7104, 5962013397104 | ||||
| 5930-01-509-5433 (5930015095433) | 5935-00-915-3473 (5935009153473) | 5961-00-838-3528 (5961008383528) | 5950-01-019-3776 (5950010193776) | |
| 5930-00-075-8158 (5930000758158) | 5925-01-522-8369 (5925015228369) | 5985-01-383-3200 (5985013833200) | 5910-01-443-5198 (5910014435198) | |
| 5998-01-145-3516 (5998011453516) | 5905-00-835-0605 (5905008350605) | 5935-00-501-1875 (5935005011875) | 5999-01-271-9920 (5999012719920) | |
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