We appreciate your interest in our selection of parts that fall under the NSN 5962-01-331-7106. Below, top-requested part numbers like PAL16L8DCJ, PAL16L8DMJ 883B, 5962-8515509BRX, 5962-8515509RA, PLUS16L8 BRA, and others are presented alongside their manufacturer for your perusal. In order to receive pricing options on any featured NSN 5962-01-331-7106, simply click on the “RFQ” button next to it and complete the quote request form you are directed to. Be sure to include as many details as you can about your requirements and restrictions alike so our team can best formulate ideal fulfillment options for your consideration.
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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-331-7106 (013317106) |
| NCB Code | USA (01) |
| Manufacturer | Advanced Micro Devices Inc, Mmi Amd, Dla Land And Maritime, Philips Semiconductors Ltd, Bae Systems Inc, Texas Instruments Inc |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| PAL16L8DCJ | advanced micro devices inc | microcircuit memory | RFQ |
| PAL16L8DMJ 883B | mmi amd | microcircuit memory | RFQ |
| 5962-8515509BRX | dla land and maritime | microcircuit memory | RFQ |
| 5962-8515509RA | dla land and maritime | microcircuit memory | RFQ |
| PLUS16L8 BRA | philips semiconductors ltd | microcircuit memory | RFQ |
| 5962-8515509RX | dla land and maritime | microcircuit memory | RFQ |
| 5962-85155 | dla land and maritime | microcircuit memory | RFQ |
| 5962-8515509BRB | dla land and maritime | microcircuit memory | RFQ |
| ROM PROM HEAD 200 | dla land and maritime | microcircuit memory | RFQ |
| PAL-025 | bae systems inc | microcircuit memory | RFQ |
| TIBPAL16L8-15MJB | texas instruments inc | microcircuit memory | RFQ |
| 5962-8515509BRA | dla land and maritime | microcircuit memory | RFQ |
| 5962-8515509RB | dla land and maritime | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND MONOLITHIC AND BIDIRECTIONAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| Relevant Components for NSN - 5962-01-331-7106, 5962013317106 | ||||
| 5935-01-293-3127 (5935012933127) | 5999-00-437-6049 (5999004376049) | 5998-01-344-5832 (5998013445832) | 5910-01-060-9297 (5910010609297) | |
| 5950-01-023-5955 (5950010235955) | 5935-00-564-1316 (5935005641316) | 5950-00-600-0785 (5950006000785) | 5935-01-447-1650 (5935014471650) | |
| 5995-01-271-2563 (5995012712563) | 5910-00-644-6161 (5910006446161) | 5910-00-064-4702 (5910000644702) | 5950-01-441-4266 (5950014414266) | |
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