We appreciate your interest in our selection of parts that fall under the NSN 5962-01-331-6394. Below, top-requested part numbers like 5962-8752902BLB, WS57C45-35TMB, ROM PROM HEAD 167, 5962-8752902BLA, 5962-8752902BLX, and others are presented alongside their manufacturer for your perusal. In order to receive pricing options on any featured NSN 5962-01-331-6394, simply click on the “RFQ” button next to it and complete the quote request form you are directed to. Be sure to include as many details as you can about your requirements and restrictions alike so our team can best formulate ideal fulfillment options for your consideration.
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Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-331-6394 (013316394) |
NCB Code | USA (01) |
Manufacturer | Dla Land And Maritime, Waferscale Integration Inc, Cypress Semiconductor Inc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
5962-8752902BLB | dla land and maritime | microcircuit memory | RFQ |
WS57C45-35TMB | waferscale integration inc | microcircuit memory | RFQ |
ROM PROM HEAD 167 | dla land and maritime | microcircuit memory | RFQ |
5962-8752902BLA | dla land and maritime | microcircuit memory | RFQ |
5962-8752902BLX | dla land and maritime | microcircuit memory | RFQ |
CY7C245-35WMB | cypress semiconductor inc | microcircuit memory | RFQ |
5962-8752902LA | dla land and maritime | microcircuit memory | RFQ |
CY7C245-35WC | cypress semiconductor inc | microcircuit memory | RFQ |
5962-87529 | dla land and maritime | microcircuit memory | RFQ |
5962-8752902LB | dla land and maritime | microcircuit memory | RFQ |
5962-8752902LX | dla land and maritime | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | ROM |
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
CZZZ | MEMORY CAPACITY | UNKNOWN |
Relevant Components for NSN - 5962-01-331-6394, 5962013316394 | ||||
5935-01-666-8644 (5935016668644) | 5975-01-685-2912 (5975016852912) | 5935-01-627-9337 (5935016279337) | 5935-01-591-6093 (5935015916093) | |
5935-01-227-1535 (5935012271535) | 5998-00-422-0779 (5998004220779) | 5998-01-362-4250 (5998013624250) | 5930-01-009-0231 (5930010090231) | |
5910-01-574-9147 (5910015749147) | 5950-01-350-8713 (5950013508713) | 5935-01-028-3658 (5935010283658) | 5998-01-185-1571 (5998011851571) | |
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