We appreciate your interest in our selection of parts that fall under the NSN 5962-01-303-8871. Below, top-requested part numbers like IDT7132L70LB52, IDT7132LA70L52B, 717801483-001, IDT71321SA55L52B, CY7C136-55LMB, and others are presented alongside their manufacturer for your perusal. In order to receive pricing options on any featured NSN 5962-01-303-8871, simply click on the “RFQ” button next to it and complete the quote request form you are directed to. Be sure to include as many details as you can about your requirements and restrictions alike so our team can best formulate ideal fulfillment options for your consideration.
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Item Name | Microcircuit Memory |
Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
National Item Identification Number (NIIN) | 01-303-8871 (013038871) |
NCB Code | USA (01) |
Manufacturer | Integrated Device Technology Inc, Lockheed Martin Corporation, Cypress Semiconductor Inc |
Part Number | Manufacturer | Item Name | RFQ |
---|---|---|---|
IDT7132L70LB52 | integrated device technology inc | microcircuit memory | RFQ |
IDT7132LA70L52B | integrated device technology inc | microcircuit memory | RFQ |
717801483-001 | lockheed martin corporation | microcircuit memory | RFQ |
IDT71321SA55L52B | integrated device technology inc | microcircuit memory | RFQ |
CY7C136-55LMB | cypress semiconductor inc | microcircuit memory | RFQ |
CY7C136-55JI | cypress semiconductor inc | microcircuit memory | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.761 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.120 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.761 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.761 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.761 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.088 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND HIGH SPEED AND HERMETICALLY SEALED AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 37 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-6 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 52 LEADLESS |
Relevant Components for NSN - 5962-01-303-8871, 5962013038871 | ||||
5995-01-583-6913 (5995015836913) | 5905-00-225-2020 (5905002252020) | 5935-01-682-3961 (5935016823961) | 5985-00-880-3578 (5985008803578) | |
5935-01-284-5028 (5935012845028) | 5996-00-644-4427 (5996006444427) | 5930-01-356-0596 (5930013560596) | 5905-01-423-2384 (5905014232384) | |
5998-01-097-3169 (5998010973169) | 5930-00-490-4504 (5930004904504) | 5950-00-187-2893 (5950001872893) | 5998-01-076-5349 (5998010765349) | |
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