We appreciate your interest in our selection of parts that fall under the NSN 5962-01-264-5237. Below, top-requested part numbers like PAL16R8AML 883B, AMPAL16R8A B2A, 10133854, PAL16R8AMFKB, 81036, and others are presented alongside their manufacturer for your perusal. In order to receive pricing options on any featured NSN 5962-01-264-5237, simply click on the “RFQ” button next to it and complete the quote request form you are directed to. Be sure to include as many details as you can about your requirements and restrictions alike so our team can best formulate ideal fulfillment options for your consideration.
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| Item Name | Microcircuit Memory |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5962 Microcircuits Electronic |
| National Item Identification Number (NIIN) | 01-264-5237 (012645237) |
| NCB Code | USA (01) |
| Manufacturer | Mmi Amd, Advanced Micro Devices Inc, Nimikkeistokeskus Ncb Finland, Texas Instruments Inc, Dla Land And Maritime, Raytheon Company |
| Part Number | Manufacturer | Item Name | RFQ |
|---|---|---|---|
| PAL16R8AML 883B | mmi amd | microcircuit memory | RFQ |
| AMPAL16R8A B2A | advanced micro devices inc | microcircuit memory | RFQ |
| 10133854 | nimikkeistokeskus ncb finland | microcircuit memory | RFQ |
| PAL16R8AMFKB | texas instruments inc | microcircuit memory | RFQ |
| 81036 | dla land and maritime | microcircuit memory | RFQ |
| 81036082B | dla land and maritime | microcircuit memory | RFQ |
| 81036082A | dla land and maritime | microcircuit memory | RFQ |
| G281248-852 | raytheon company | microcircuit memory | RFQ |
| 81036082X | dla land and maritime | microcircuit memory | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT,MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| Relevant Components for NSN - 5962-01-264-5237, 5962012645237 | ||||
| 5935-01-393-9456 (5935013939456) | 5995-01-130-0424 (5995011300424) | 5905-01-026-0713 (5905010260713) | 5905-01-081-8903 (5905010818903) | |
| 5999-00-307-3125 (5999003073125) | 5995-01-119-5176 (5995011195176) | 5950-00-147-1400 (5950001471400) | 5985-01-027-3311 (5985010273311) | |
| 5965-01-661-1950 (5965016611950) | 5985-01-045-7409 (5985010457409) | 5930-01-630-3448 (5930016303448) | 5935-00-242-1833 (5935002421833) | |
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